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Support 2 * DDR4 Intel 13 CPU Mini PC GM3
Mini PC&Mini host

Support 2 * DDR4 Intel 13 CPU Mini PC GM3

Processor specifications

CPU:

Intel i7-1270P / i7-1280P 1340P 1360P ect.
TDP: 28W
Intel i7-12700H / i7-12900H 13700H 13900H ect. TDP: 45W

CPU terrace:

Intel 12 Generation of 13TH  CPU

Video card:

Intel® Iris® Xe Graphics Support for 4-display

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Product Detailed Specification

Processor specifications

CPU:

Intel i7-1270P / i7-1280-P 1340P 1360P ect. TDP: 28W Intel i7-12700H / i7-12900H 13700H 13900H ect. TDP: 45W

Internal storage

Memory type:

DDR 4  2133 MHz / 2400 MHz / 2666 MHz / 3200 MHZ or 2 * DDR5 4800Mhz / 5200 Mhz

CPU terrace:

Intel 12 Generation of 13TH  CPU

Memory slot:

2*DDR4 S0-DIMM up to 64GB or 2*DDR5 S0-DIMM up to 96GB

Video card:

Intel® Iris® Xe Graphics Support for 4-display

Front panel

Boot button:

1*Power Button

Back panel

Power port:

1*DC Jack 5.5*2.5mm(12-19V)

Thunder and lightning:

1*Thunder bolt4 (compatible with PD power supply)

Network interface:

2*RJ45   2500M

USB joggle:

4*USB3.2 Gen1

Displays the interface:

2*HDMI 0ut 2.04K 60HZ 1*DP 1.4 1*Type-C Thunderbolt 4

Audio interface:

1*3.5mm earphone / 1*3.5mm MIC in

USB joggle:

2*USB2.0

Extended slot

WiFi slot:

1*M. 2 2230 slot (WIFI / BT support) WiFi:802.11 b / g / n / AC / AX Bluetooth 4.0 or above

Other parameters

Appearance size:

174X128X45mm

SSD slot:

1*M. 2 2280 slot (SATA / NVME Gen3 X4 support) 1*M. 2 2280 slot (NVME PCIE GEN4 X4)

Ontology weight:

About 500g

HDD:

1*SATA HDD 2.5inch (optional)

Power adapter:

12V-19V 90W

BIOS support:

AMI UEFI BI0S, Support for PXE, WOL

Work environment

Temperature: 0~50℃ Humidity: 5%~95%

Storage environment

Temperature: -20~70℃ Humidity: 5%~95%

Intel 12/13th generation heterogeneous design

1. Intel 12/13th generation heterogeneous design: Reconstructing the performance ceiling of mini PC

Equipped with Intel i7-13700H to i9-13900H processors (14 cores and 20 threads, 45W TDP), Intel Thread Director technology intelligently schedules performance cores and energy efficiency cores, and multi-tasking efficiency is 71% higher than traditional mini PCs.

Energy efficiency revolution:

Dynamic TDP adjustment (28W-65W), Blender rendering power consumption fluctuation <8%.

Liquid metal heat conduction + carbon fiber air duct design, continuous load surface temperature ≤41℃ (noise 28dBA).

Scene test:

8K video real-time color grading (DaVinci Resolve).

Industrial simulation calculation (MATLAB speed increased by 55%).

2. Four-protocol Thunderbolt 4: cross-border connection hub for mini pc

Technological breakthrough:

Single interface supports 40Gbps data transmission/8K@60Hz output/100W PD power supply.

Compatible with external GPU docking station (RTX 6000 Ada) and PCIe capture card.

Scene adaptation:

Scientific research instrument control (real-time analysis of mass spectrometer data stream).

Esports live streaming (4-way 4K picture synchronous acquisition).
Support 2  DDR4 Intel 13 CPU Mini PC GM3 (1)

3. Dual-mode memory architecture: DDR4/DDR5 free switching.

The world's first mini pc that supports DDR4-3200 and DDR5-5200 dual protocols PC:

96GB DDR5 memory bandwidth reaches 83GB/s, 3D modeling cache efficiency is improved by 40%.

DDR4 mode is compatible with old devices for smooth upgrade.

Enterprise-level features:

ECC memory check (optional), financial transaction error rate is zero.

Asymmetric memory configuration support (32GB+64GB mixed insertion).

4. Dual PCIe 4.0 SSD+anti-vibration HDD: data torrent solution

Storage matrix:

PCIe 4.0x4 SSD sequential read and write 7,400/6,500MB/s (2.3 times faster than the previous generation mini PC).

2.5-inch HDD equipped with a three-dimensional shock-absorbing frame (impact resistance 50

Scenario adaptation:

8-way 4K surveillance storage (RAID 5 mode support).

Mobile surveying and mapping data cold backup (direct reading in -20℃ environment).
Support 2  DDR4 Intel 13 CPU Mini PC GM3 (2)

Industry scenario solutions

1. Smart factory digital twin

Four-screen output (production line monitoring + 3D model + data dashboard + control terminal).
Dual 2.5G network ports to achieve physical isolation of OT/IT networks.

2. Portable medical imaging station

Thunderbolt 4 directly connected to CT angiography equipment (DICOM 3.0 standard).
Antibacterial coating shell (optional) + medical electromagnetic compatibility certification.

3. Edge AI inference gateway

Support OpenVINO toolkit, 16-channel video stream real-time analysis.
M.2 expansion 5G module, latency <15ms.

OEM/ODM customization service

Hardware deep transformation:

Optional CAN bus/GPIO industrial control board.
Customized cooling solution (-40℃~85℃ wide temperature operation).

Enterprise-level management suite:

Intel vPro remote maintenance + TPM 2.0 encryption.
Dual BIOS protection + firmware signature verification.

Strict certification guarantee:

IEC 61000-6-2 industrial electromagnetic compatibility certification.
MIL-STD-810H military specification dust and shock resistance.

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